Job Responsibilities:

 1.Responsible for on-site installation guidance of equipment and providing technical guidance to customers.

 2.According to the contract or technical agreement, responsible for the installation and commissioning of the equipment until it meets the customer's product requirements.

 3.Propose improvement suggestions for design and usage deficiencies of the equipment, optimize and provide technical improvement plans.

 4.Upon completion of after-sales service, issue a service summary report, proposing rationalization suggestions for problems encountered during the service.

 5.Establish a professional image for the company, with good communication skills.

 6.On-site investigation of customer complaints and complaints issues.

 7.Complete other tasks assigned by superior management.

Qualifications:

 1.At least 3 years of experience in maintenance of semiconductor packaging equipment (die bonder/wire bonder), with priority given to candidates with experience in various brand equipment.

 2.Ability to travel, must possess a C1 driver's license.

 3.Possess excellent communication and analytical skills, along with certain abilities to train others.

 4.Proficient in using common office software.